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WHAT OUR CUSTOMERS
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COMPREHENSIVE HDTV SILICON COVERAGE |
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Foundation Methodologies
Display Insights’ methodologies are fundamental to our industry leading HDTV silicon research and analysis. We attempt to deliver accurate industry data and analysis by: - Leveraging our long-standing display industry relationships to regionally survey component suppliers, display OEMs and display manufacturers.
- Conducting extensive interviews across each silicon sub-system to cross-reference findings (tuners, demodulators, MPEG processors, image post processors and interconnects).
- Conducting extensive interviews with both buyers and sellers to cross-reference findings.
- Creating system-wide BOMs (bill-of-materials) for the entire HDTV silicon architecture, including interconnects and board layer assembly to provide a comprehensive view of the competing flat panel display architectures.
Specific Methodologies Leveraged
The specific methodologies leveraged to create our new “The Future HDTV Architecture Revealed” report, include:
- Individual, regional interviews: Semiconductor suppliers, display OEMs and flat panel manufacturers were surveyed by vendors, segments, products, design wins and average selling prices (ASPs). ASPs and design wins were primarily obtained by leveraging regional channel partners who are located in Japan, Korea, Taiwan, China and the Europe to improve accuracy. In many cases, the semiconductors were sold within a bundled chip-set rather than an individual SKU sale. In those cases, individual semiconductor pricing was determined by cross-referencing the market value of that specific display function in the bundle. Surveying was conducted by way of face-to-face and phone-based individual interviews.
- Exhaustive web research: Web-based research was also performed to compliment and in some cases confirm interview findings.
System Architecture Adoption Modeling - HDTV architectural adoption forecasts were determined by interviewing ASIC vendors in combination with surveying industry channel members regarding technology roadmaps and corresponding technical samples (TS), engineering samples (ES) and mass production (MP) timelines.
System Architecture & Sub-Component ASP Modeling - HDTV architectural ASP modeling (2010-2013) was determined by historical trends (through public data, channel relationships and other industry sources). We then modeled individual, sub-component price estimates weighted by the demand for various ASIC solutions and/or sub-architectures in combination with silicon geometries and wafer pricing.
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New Research