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COMPREHENSIVE HDTV SILICON COVERAGE
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New Research
"INNOVATION, PARTNERSHIP AND DEATH:
The New Economics of HDTV Semiconductors"

The report covers 92 unique semiconductor manufacturers (50 privately held). Each key silicon component within today’s HDTV is identified, analyzed, and forecasted. This is the industry's only report that tracks the HDTV semiconductor market to the individual component level. The report includes company-specific analysis by:
The HDTV Ecosystem Revealed
  • Architectural Partitioning (including 120Hz, ultra-thin, MPEG-4)
  • Market Segments (20", 26", 32", 37", 42", 52")
  • Individual Component Pricing (ASPs)
  • Technology Roadmaps
  • Design Wins
  • Positioning Forecasts
  • Management Teams
Who it Helps?
This report was created by regional industry insiders to provide clarity to the rapidly changing, previously undocumented HDTV silicon market amid the 2009 global climate. The detailed findings and insights are targeted to aid:
  • Semiconductor manufacturers
  • Flat-panel display manufacturers
  • HDTV supply-chain partners
  • Display related investors / analysts
What is Unique About this Report?
This report stands alone from a quality level when compared to other competitive research offerings due to its highly detailed functional block diagrams of the leading HDTV system architectures, including individual IC component analysis organized by:
  • Vendor
  • Display function
  • Market segment
  • Price (ASP)
The report also maps these competing HDTV sub-architectures to individual display OEMs and their corresponding retail television brand partners.

What Critical Questions are Answered?
The report uncovers unique insights that provide answers to the following questions:
  • What companies (public and private) are competing in the HDTV ecosystem?
  • What are these companies products and technology roadmaps?
  • How is the HDTV architecture being partitioned by the leading silicon manufacturers?
  • How will the architecture change to best accommodate 120Hz, MCFRC, MPEG-4 and ultra-thin integration?
  • What architectures are growing in market share? What architectures are falling behind?
  • What are the price differences across these competing HD architectures (2009-2012)?
  • What is the sub-component pricing for each ASIC within these architectures?
  • What are the anticipated price trends for each 1080i sub-component for the next 4 years (2009-2012)?
  • What are the anticipated price trends for each 1080P sub-component for the next 4 years (2009-2012)?
  • What are the anticipated price trends for each M sub-component for the next 4 years (2009-2012)?
  • How will individual sub-component pricing (ASPs) be impacted by upcoming process geometry and integration trends  (i.e., MCFRC, 120Hz, ultra-thin displays and MPEG-4)?
  • What HDTV semiconductor segments are best positioned to thrive amid the 2009 economic climate?
  • What HDTV semiconductor segments are most threatened amid the 2009 economic climate?
  • Which individual HDTV semiconductor companies are most likely to thrive in today's economic climate?
  • Which individual HDTV semiconductor companies are most likely to suffer  in today's economic climate?

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